Hi Somtawin,

First thing I'd suspect is oxidation/contamination of the solderable surface. EDS may not catch it if it's just oxidation (the layer would be too thin for the method). lathe fact that you see Fe does not make me very optimistic. How does it show up, as inclusions (embedded into the surface) or "dissolved" in the plating? Second thing would be the content of P. If it's too high, then it might be a problem as well.

Regards,

Vladimir

Vladimir Igoshev, 
Research in Motion



-----Original Message-----
From: Somtawin Pornpottanamas [mailto:[log in to unmask]]
Sent: Tuesday, March 16, 2004 11:44 PM
To: [log in to unmask]
Subject: [TN]


Now we have some problem in one component. The component was plated
Nickel (electroplated) , and  base material is phosphor bronze. The
problem we found was solderability failed. We try to find out what's the
cause. We have to inspect the solderability   by dipping test before
passed to the line. Some failed some passed. we had done the analysis to
compare the good one and bad one. We had check Nickel thickness (XRF,
cross section), phosphorus content and grain structure (by SEM & EDX).
From  the data , it show the different. But we don't know how does it
effect to the solderability. Does anyone know what 's the parameter that
affect to solderability, how? And what 's about the contaminate in
Nickel bath ? 

From EDX we found Fe element in bad part, does Fe effect to
solderability? 

 

Thanks & Regards,

Somtawin Pornpottanamas

 


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