Doug,
Besides the other inputs, I forgot to tell you I would help you on this
task.My problem is that I no longer have a captive PWB shop or CCA assembly
facility.
Dewey

> -----Original Message-----
> From: Douglas O. Pauls [SMTP:[log in to unmask]]
> Sent: Monday, March 15, 2004 12:29 PM
> To:   [log in to unmask]
> Subject:      [TN] Process Qualification Vehiicle
>
> Good morning/afternoon/evening everyone,
>
> At the last round of technical meetings at Apex, I took the liberty of
> signing you all up for various committee work.  As I tell the co-op
> students I mentor, "you go to meetings to protect yourself from action
> items".  Since most of you were not there, you got assigned action items.
>
> This question goes to those individuals tasked with determining if a
> proposed or existing manufacturing process has "sufficient" materials and
> process compatibility.  You get to determine if a new process or an
> existing process has a propensity for electrochemical failure mechanisms
> (leakage, corrosion, dendritic growth).  You must choose the test vehicle
> by which to demonstrate this compatibility for J-STD-001, and surface
> insulation resistance testing is to be the metric.
>
> Question 1:
> Do you use actual hardware and your existing life/reliability tests under
> humid conditions,
> OR
> Do you use a standardized test vehicle from the IPC, representative of
> your
> assembly technology?
>
> Question 2:
> If you choose to use a standardized test vehicle, would you prefer to use
> an off the shelf design, which may be a stretch to represent your
> technology,
> OR
> if you were told how to do it, would you build your own test vehicle from
> a
> menu of acceptable SIR test patterns, that WAS representative of your
> product?
>
>
> I ask these questions, and more will follow, because, fool that I am, I
> agreed to re-write the Appendix B testing currently in J-STD-001C as part
> of the Rev D effort.  Seems I just can't say no to Teresa Rowe.  Rev D, as
> it is now, will make such Appendix B testing manditory.  The drawbacks of
> previous test approaches have always been the applicability of the
> standardized test substrates (e.g IPC-B-36) to actual product.
>
> Graham Naisbitt, a valued contributor to Technet, is leading a similar
> effort for the IEC and we would like to co-ordinate efforts and come to a
> consensus for testing.  We are talking about the best ways to do process
> qualification/validation testing.  The first step is to come to agreement
> on what substrate to test.  The discussion is also ongoing on IPC's SIRNet
> forum.  Graham has a proposed test vehicle , but in looking at it, there
> would be a number of changes that I would want to see from Rockwell's
> perspective to make it more representative of our product.  I imagine the
> same could be said of the rest of you, especially in the high rel world.
>
> I look forward to the responses.  If you prefer to keep the responses
> private, communicate with me off-line.  I need to have a draft for review
> by the May 6-7 meetings.
>
> Thank you.
>
> Doug Pauls, who needs his head examined
> Rockwell Collins
>
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