All plating is a "donation" of electrons to the metal ions in solution to
turn them from charged ions to the metal form.

In electroplating, the electrons are pumped to the work being plated by the
rectifier.  In electroless plating, the electrons are donated by another
chemical in solution...formaldehyde, or hypophosphite.  In immersion plating, the
substrate metal dissolves, and in the process gives up electrons, which transfer
to the metal being plated out.

In your case you have exposed Copper or Nickle going into solution, and
giving up electrons in the process, and their electrons are transferred to the Gold
by the Copper traces, where they react with the Silver in solution...and
voila!  Magic!

Is this clearer?

Rudy Sedlak
RD Chemical Company

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