TECHNET Archives

March 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Edward Szpruch <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 14 Mar 2004 15:39:18 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines)
Hi Rudy,
Of course there is exposed copper and nickel ( the board was made using gold
as etch resists, so there is exposed copper and nickel on sidewalls of
conductors), by why Silver, less noble and lower in electroafinity list than
Gold, is plating on Gold surfaces?  Believe me, adhesion is very good.Tested
per IPC method using 3M standard tape for adhesion tests.
I made this test just to decide how to process PCB with gold plated fingers
in immersion Silver finishing.So the answer is : gold plated areas have to
be masked . But still - I was suprised.
And you know - in Holyland Sunday is like Monday...
Edward

Edward Szpruch
Eltek Ltd
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

> -----Original Message-----
> From: Rudy Sedlak [SMTP:[log in to unmask]]
> Sent: א מרץ 14 2004 15:23
> To:   [log in to unmask]
> Subject:      [TN] Immersion Silver on Gold
> 
> Edward:
> 
> It is far too early to be up on Sunday morning, but being awake, I will
> answer your question, even though it was directed at Bev.
> 
> If the Gold plating is in electrical contact with any surface which will
> plate the Silver, such as Copper, or perhaps Nickle, and both surfaces are
> in the
> Silver plating solution, the Silver will plate everywhere... In immersion
> plating, the plating is caused by dissolution of the substrate metal,
> usually
> Copper in our industry, but the dissolved metal does not have to come from
> where
> the plated metal is actually deposited.
> 
> I hope I have made this clear.
> 
> Rudy Sedlak
> RD Chemical Company
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2