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March 2004

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Subject:
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 14 Mar 2004 08:22:54 EST
Content-Type:
text/plain
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text/plain (27 lines)
Edward:

It is far too early to be up on Sunday morning, but being awake, I will
answer your question, even though it was directed at Bev.

If the Gold plating is in electrical contact with any surface which will
plate the Silver, such as Copper, or perhaps Nickle, and both surfaces are in the
Silver plating solution, the Silver will plate everywhere... In immersion
plating, the plating is caused by dissolution of the substrate metal, usually
Copper in our industry, but the dissolved metal does not have to come from where
the plated metal is actually deposited.

I hope I have made this clear.

Rudy Sedlak
RD Chemical Company

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