All changes made when documents are revised should be made to either
correct an error, update criteria based on lessons learned or changes in
technology, or the addition of new technology.
There are costs associated with every assembly operation step and each
cost (real $ or impact on life cycle) should have justification or
should be eliminated. The committees are very concerned about both cost
and life cycle/reliability issues.
In this particular instance, the committee had to resolve a number of
comments from industry users that they didn't want to have to write
exception statements to 610 when they wanted >1 W components flush
mounted--the norm for all other axial leaded components. The committee
came to agreement that the NEED to space a component off the board
should NOT be made by the assembler who often has no knowledge of
circuit needs. The designer should make the decision on if, how, and how
much such spacing should be implemented. Therefore, Rev C has the
following criteria:
Clause 5.2.1:
Defect - Class 1,2,3
* Components required to be mounted above the board surface
are less than 1.5 mm [0.059 in].
Clause 5.2.2
Target - Class 1,2,3
* The entire body length of the component is in contact with
the board surface.
* Components required to be mounted off the board are at
minimum 1.5 mm [0.059 in] from the board surface; e.g.,
high heat dissipating.
* Components required to be mounted off the board are provided
with lead forms at the board surface or other
mechanical support to prevent lifting of solder land.
Defect - Class 1,2,3
* Components required to be mounted off the board are not
provided with lead forms at the board surface or other
mechanical support to prevent lifting of solder land.
* Components required to be mounted above the board surface
are less than 1.5 mm [0.059 in].
Revision D is in the final stages; you are welcome to submit
substantiation to the committee to show why the requirement should be
changed. You can submit your comments directly to me if you wish.
The next meeting for this committee will be the first week of May in
Austin Texas. The J-STD-001D and IPC/WHMA-A-620 committees will each be
meeting for two days during that week also, starting with A-620 Sun-Mon,
610 Tues-Wed, and J-STD-001 Thurs-Fri.
Jack Crawford
Director, Certification and Assembly Technology
[log in to unmask]
847-790-5393
fax 847-504-2393
-----Original Message-----
From: Morse, Carrie [mailto:[log in to unmask]]
Sent: Thursday, March 11, 2004 12:24 PM
To: [log in to unmask]
Subject: [TN] Out of curiosity then...Why was this specification removed
from B to C?
So,
Out of curiosity then...Why was this specification removed from B to C?
-Carrie
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bissonnette,
Jean-Francois
Sent: Thursday, March 11, 2004 10:21 AM
To: [log in to unmask]
Subject: Re: [TN] Can't remember a darned thing!
IPC-A-610 Reb B, Section 3.2.1
"The space between any component that dissipates 1 Watt or greater and
the board surface should be at least 1.5mm above the board surface"
Ciao!
JF
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Morse, Carrie
Sent: Thursday, March 11, 2004 9:27 AM
To: [log in to unmask]
Subject: [TN] Can't remember a darned thing!
Since, for some reason, I can't remember a darned thing lately, I was
wondering if someone could tell me WHERE within all of our IPC specs I
can find where it specifies at what wattage we need to start raising
resistors off the board (ex: 1W, 1.5W?)
Thanks,
Carrie
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