Thanks for the valuable input.

Please note that the last thing I want is to give microVIP a bad name.
Therefore I have to clarify that my original questions apply to 0.010" vias,
mainly on 0.050"x0.040" pads.

Best regards,
Ioan

-----Original Message-----
From: Macko, Joe @ IEC
To: [log in to unmask]
Sent: 3/11/2004 6:51 PM
Subject: Re: [TN] Reliability of via in pad

Gary,

Good points.  Can you refer me to any studies that associate VIP design
vs.
"unacceptable"  voiding?  A little voiding may be good for reliability
but
too much is not good.  I struggle with determining how large or deep a
VIP
can be before it contributes or causes unacceptable voiding.

joe

-----Original Message-----
From: Gary Ferrari [mailto:[log in to unmask]]
Sent: Thursday, March 11, 2004 2:20 PM
To: [log in to unmask]
Subject: Re: [TN] Reliability of via in pad


Technetters,

Please let us not throw the baby out with the bath water. I would hate
for
VIP technology to get a bad name when in essence your valid concerns are
associated with larger vias than used in HDI technology. A similar panic
was
created
against dry film soldermasks because the commonly used dry film mask
thicknesses were around 0.006 in. When mask manufacturers introduced
high
conformance
thin masks (0.001 - 0.002 in) to address the needs of SMT , everyone
shunned
them because they were "dry film", when in reality their gripes were
with
the
thicker cousins.

Regards,

Gary

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