Hi Dave!

Doug would be able to do that on Mt. Dews? You're right about the mod not
being able to survive anything, but it doesn't have to. This assembly is
basically a proof of concept prototype.

It's from the same family of prototypes we're doing here that had me put that
PowerPC BGA on the SMT-to-PTH adapter a week or so ago. I've got another one
I have to put together for this assembly. This one has 361 balls instead of
256 balls like that last one.

-Steve Gregory-


> Hi Steve! Wow, looks like something Doug would solder together after a few
> too many Diet Mt. Dews! But you have great timing - we just published our
> solder joint modification configuration paper at the APEX show. The test
> data shows that your "whatchamacallit" configuration will not survive Class
> 3 thermal cycling (-55C to +125C) due to a lack of stress relief in the mod
> wire. Also, putting a ceramic component in a vertical configuration leaves
> it very susceptible to being cracked. And last but not least, did the
> designer address the "whatchamacallit" vibration reliability aspects? I
> don't believe this solder joint modification configuration is going to be
> reliable in a Class 2 use environment. Good Luck!
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>


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