Wow Steeve

Can you send me a copy too?

Thanks a lot

Guenter


Mornin' Daan!

I'm sending you a paper called Solder Fatigue Reliability Issues in
Lead
Free BGA Packages given by Pedro Chalco of IBM. The paper was
presented
at the Pan Pacific Microelectronics Symposium sponsored by SMTA and
held
in Maui, on February 4-7, 2002.

There is reliability data from Lead Free BGA's being soldered with
SnPb
solder paste.

Best Regards,

-Steve Gregory-

> Hi Technet,
>
> I'm looking for a paper that was presented by Qualcomm at last year's

> IPC conference in Frankfurt. I heard it includes some good
information

> about the reliability of leadfree BGA's soldered with PbSn
> solderpaste. Is there anyone out there who's willing to provide me
> with a copy ?
>
> Daan Terstegge
> Thales Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net
>






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EMPA
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