Jeff

Virtually impossible to solve your problem without seeing the specimen.
What you need is a failure analysis to see why the dewetting occurred:
- Micro sections through the dewetted joints (Did  the dewetting go
along the surface of the plating, or along the base material? Did the
solder alloy with the plating or with the base material? How does the
interface solder substrate look like?.....)
- Analysis of the plating as well as the soldered interface (Light,
SEM, EDX ev. search for surface contaminants with TOF- SIMS)

If we know where the dewetting occurred and if the solder alloyed with
the plating, if the plating, how much of it took place in the reaction
or if something happened anyway we can proceed to find out why this
happened.

Best regard

Guenter

EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

>>> [log in to unmask] 03/10 1:32   >>>
Dear Soldering Gurus,

I currently have a dewetting problem with silver electroplated parts
and I
was hoping that Technet would provide me with some suggestions.

A brief history - Our silver plating solution has been changed as our
old
solution is no longer available. We are using water soluble 62/36/2Ag
solder
paste. Our soldering process works very well on old tarnished
components
from the previous plating solution, but demonstrates dewetting in
components
plated with the new solution. The rest of the process appears to be the
same.

Any hints on particulars to watch out for or test would be greatly
appreciated.

Regards and thanks,
Jeff Brown
The Australian National University

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