Great input Steve, and the best part is that it makes an end to some of
my compatibility-worries. Now I'll sleep better at night!
The report states that even with PbSN solderpaste the leadfree BGA's
have a superior resistance to solder-joint fatigue failure when compared
to conventional parts.
Don't know about the copyrights for this one, do you you think it would
be appropiate to upload this to my website ?

Thanks!

Daan

>>> <[log in to unmask]> 03/08/04 03:04pm >>>
Mornin' Daan!

I'm sending you a paper called Solder Fatigue Reliability Issues in
Lead Free
BGA Packages given by Pedro Chalco of IBM. The paper was presented at
the Pan
Pacific Microelectronics Symposium sponsored by SMTA and held in Maui,
on
February 4-7, 2002.

There is reliability data from Lead Free BGA's being soldered with SnPb

solder paste.

Best Regards,

-Steve Gregory-

> Hi Technet,
>
> I'm looking for a paper that was presented by Qualcomm at last
year's
> IPC conference in Frankfurt. I heard it includes some good
information
> about the reliability of leadfree BGA's soldered with PbSn
solderpaste.
> Is there anyone out there who's willing to provide me with a copy ?
>
> Daan Terstegge
> Thales Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net
>

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