Mornin' Daan!

I'm sending you a paper called Solder Fatigue Reliability Issues in Lead Free
BGA Packages given by Pedro Chalco of IBM. The paper was presented at the Pan
Pacific Microelectronics Symposium sponsored by SMTA and held in Maui, on
February 4-7, 2002.

There is reliability data from Lead Free BGA's being soldered with SnPb
solder paste.

Best Regards,

-Steve Gregory-

> Hi Technet,
>
> I'm looking for a paper that was presented by Qualcomm at last year's
> IPC conference in Frankfurt. I heard it includes some good information
> about the reliability of leadfree BGA's soldered with PbSn solderpaste.
> Is there anyone out there who's willing to provide me with a copy ?
>
> Daan Terstegge
> Thales Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net
>






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