Hi Technet,
I'm looking for a paper that was presented by Qualcomm at last year's
IPC conference in Frankfurt. I heard it includes some good information
about the reliability of leadfree BGA's soldered with PbSn solderpaste.
Is there anyone out there who's willing to provide me with a copy ?
Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
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