Following the same train of thought....
Does anyone know of any issues using matte Sn finish leaded and QFN packages
on a customer's board using PbSn solder as the second level interconnect?
Specifically,
Reliability?
Yield?
Modifications to standard reflow profiles?
Fear of change?
Mike
-----Original Message-----
From: Guenter Grossmann [mailto:[log in to unmask]]
Sent: Friday, March 12, 2004 4:57 AM
To: [log in to unmask]
Subject: [LF] Antw: [LF] lead-free components with PbSn process
James
- No problem using Lead free finish with SnPb solder. Neither
compatibility nor reliability
- To my knowledge whiskers are bo be solved. Approx. 1 months ago I
spoke to a representative of Motorola (technical not commercial) who
said that whiskers are no issue for them by now.
- Yes these components will, in my opinion, definitely die.
Maybe no advice but an opinion.
Best regards
Guenter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
>>> [log in to unmask] 03/11 9:27 >>>
Good Day All:
I've posted a similar question on technet, but I thought this forum
would be
more appropriate.
What are the problems, if any, with using lead-free components with a
PbSn
SMT process? Are there any compatibility issues? How about long-term
reliability for military products?
Also, is anyone concerned with the influx of components with pure tin
finishes with regard to tin whiskers?
One more thing... are there concerns that "custom" components,
specified
with a PbSn finish, might become extinct (DMS, diminishing
manufacturing
source)?
Thanks for your advice,
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
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