Here is the tentative agenda for the call tomorrow:

Agenda for Embedded Passive Call ? March 4, 2004
1:00 PM Central Time, 620-584-8200, PIN 1546#


Web page updates: Susan, Denny, on what is posted
        Procedure to be Added to Embedded Net Listing ? Reminder on how to 
sign up.

Follow-up Prior Calls:

·       Webcast on Embedded Passives earlier today ? any comments? 

Standards 
·       IPC Embedded Passive Design Guideline D-37A ? Action items from 
Embedded design session at IPC Expo, Feb 23 ? Next meeting or conference 
calls
·       IPC Embedded Passive Test D-37D? Follow up from session at IPC 
Expo, Feb 23, Next meeting or conference calls
Volunteer work between Nick Biunno, Sanmina, and Jan Obrzut, NIST ? test 
method for ?normal? board shops ? thin materials from 200 M to 2 Gigahertz
·       IPC Embedded Passive Materials D-37B ? Results from session at IPC 
Expo, Feb 25
Posting of Typical Slash Sheet on Web Page ? Discuss later today with 
Design Needs
Status of Slash Sheets from Suppliers - McGregor
·       Separation of Materials Document into IPC 4811 Resistor Materials, 
and IPC 4821 Capacitor Materials. Next meeting or conference calls
IPC Expo Session comments:
 Introduction to Embedded Passives, Dennis Fritz, MacDermid, Inc. 

Bridge the Design Tool Gap and Implement Embedded Resistors and Capacitors 
in Circuit Boards, Richard Snogren, Coretec, Inc 

Integrated Passive Component Technology and Commercialization, Richard 
Ulrich, Ph.D., University of Arkansas 

Embedded Component Design: A Hands-on Experience, Michael Fitts, Mentor 
Graphics 

Embedded Passives Laser Trim, Kim Fjeldsted, ESI,
Technical Sessions:

1. Embedded Passives-Design  2. Embedded Passives- Materials and Processes


David McGregor, DuPont Company


Other Activities:
·       UL Follow-up ? Posting of pictures of UL test patterns from IPC 
796 and 746 to EPUG site ? Tom Newton has given them to IPC Graphics 
Department.  Any results from the STP meeting on February 26 in Anaheim 
(overall coordination meeting for UL and the board community)
·        Rick Ulrich?s Column - comments on future ideas for columns. 
·       Any comments on Designers Expo next week in Santa Clara ? Snogren 
Course
·       CARTS Seminar ? Scottsdale AZ, March 31-April 4 ?Commnet by Joe 
Dougherty of Penn State
·       Two Day Embedded Passives Training ? Chicago, April April 14-15. 
(Tentative)
  Wednesday, the 14th and Thursday, the 15th is our workshop on ?Design 
and Process Implementation for Embedded Passive  Technology.?  The 
workshop will be held at IPC headquarters in our training room on the 
first floor. At the end of the day on Thursday, the attendees will go to 
the Motorola facility in Schaumburg for an evening reception (plus dinner) 
in the Motorola museum. The fee for this will be included in the workshop. 


While we are concluding our workshop at IPC on Thursday afternoon, 
Motorola will conduct a private supplier review effort at their facility 
which will be open only to Motorola engineers. The Motorola engineers 
attending that event will join us for the reception and dinner.

 Friday, the 16th is an ?Embedded Component Material Suppliers Conference? 
 and will be held at the Motorola Museum Auditorium. This conference is 
open to everyone and will be included in the workshop, however some 
individuals may want to only attend the supplier?s conference and there 
will be a fee for doing that in the brochure.
·       Embedded Passive Seminar ? Germany ? April 20-21.   Circulated 
announcement on Embedded Net. Abstract deadline ? March 5
·       Embedded Passive Seminar ? US ? Tentative on May 18-20, San Jose, 
CA, Abstracts due March 19, Papers due April 23. Solicit inputs from group 
? publicity of our group, panel discussions, etc. 
·       NEMI Roadmap ? Joe Dougherty of Penn State and Rob Sheffield of 
Nortel are contacts.   Chairman of Components group being determined. Kick 
off meeting on March 24 and 25 ? Sun Microsystems, San Jose area.
·       World Electronics Circuits Convention ? Expo/Apex 2005 ? Abstracts 
due May 1, 2004

·       Today?s Invited Speaker: Michael Jouppi ? The Thermal Man ? 
Discussion of heat effects of embedded components (resistors), and 
calculation of heat rise.  See material posted on web page by Michael, or 
visit his web site www.ThermalMan.com


·       Other business, Next Call ? March 25?