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March 2004

EmbeddedNet@IPC.ORG

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Subject:
From:
Brewster Barclay <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, Brewster Barclay <[log in to unmask]>
Date:
Wed, 24 Mar 2004 18:21:38 -0000
Content-Type:
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Hi,
I am no longer directly involved with embedded passives.  Would it be possible
to take me off the mailing list?
Many thanks.
Brewster Barclay

-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Alexandra Curtis
Sent: 24 March 2004 16:36
To: [log in to unmask]
Subject: [EM] Workshop Announcement

Design and Process Implementation for Embedded Passives Technology
April 14-15, 2004 at IPC's Headquarters in Northbrook, IL

Open panel discussion April 16, 2004 at Motorola, Inc.

Instructors: Dennis Fritz, MacDermid, Inc.; John (Jack) Fisher, Interconnect
Technology Analysis, Inc.; Richard Snogren, Coretec Denver, Inc; .Dieter Bergman
IPC; and John Andresakis, Oak-Mitsui, Inc.

With the explosive growth of wireless technology and high speed/frequency
circuits, implementing embedded passives component technology has become vital
to electronics manufacturing.

Saving assembly real estate is no longer just an important benefit since
performance often requires that resistor and capacitor devices be close to the
power I/Os of the semiconductor.  Embedded passive technology fulfills this
requirement.

This two day workshop will cover the how and why of conditions in the materials
and assembly processes that impact product performance. The difference between
integrated and embedded passive components will be explained.

This course will provide understanding and know-how for those involved in design
and manufacturing process implementation. Risk assessment and trade-offs of
embedded passive technology and its integral involvement in the interconnect
substrate will be also covered.

IPC thanks Motorola, Inc. for opening up their facility for an open panel
discussion with engineers from Motorola and other industry representatives who
are using embedded passive component technology. Get a first-hand insight into
how the implementation of embedded passives technology has improved performance
and reduced the costs of their electronic products.

Price: $595 IPC Members                 $895 Non-members

Download the registration form and more information here go to
http://www.ipc.org/calendar/DesignforEP_41404/DesignforEP_041404.htm, or contact
Christi Poulsen at [log in to unmask] or via phone at 847-790-5327.

If you are interested in participating in the open panel discussion at Motorola,
please contact Alexandra Curtis at 847-790-5377 or by e-mail at
[log in to unmask]

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