There were seminars on "Embedded Passive Devices" & "Embedded Active
Devices" at the InterNepcon Tokyo held in January, 2004.
The titles of the presentations are as follows, which may give you some of
the idea what are going on in Japan.
* Embedded Passive Devices
Development Trends of Polymer Thick film for EPD PWBs by H.
Morooka, Asahi Chemical
Everyone knows that Motorola is using Asahi Chemical's
Polymer Thick-film ink. See IPC EXPO Proceeding S39-3
Development of Sheet Device Formation which realizes EPD PWBs. by
T. Higashida, Matsushita Electric Industries
Sheet Device is a new concept announced in 2002, where
capacitors or resistors are formed onto the film materials.
They are seeking for the applications.
Recent Development of "B2IT" with Embedded Passive Components/Film
Devices by Y Fukuoka, Weisti
B2IT Technology can realize the "Chip" embedded PWBs as well
as "Formed" embedded passive devices.
Also some of the studies were done on the "Filter" .
*Embedded Active Devices
Challenge for Active Device Embedded Circuits by H. Utsunomiya,
Interconnection Technologies
New Approach for Active Device-Embedded Circuits Boards by T.
Wakabayashi, Casio Computer
This technology was co-developed by Casio and CMK. The wafer
level CSP, which is a known-good die is inserted in the build-up multilayer
boards. Embedded Wafer Level Package-EWLP). This
technology will be soon utilized in the actual application.
Integration of Passive and Active Components into Build-Up Layers by
R. Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration
(IZM)
****************************************
Interconnect Technology Information
Ryusuke Yajima
[log in to unmask]
*****************************************
-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Wednesday, March 10, 2004 7:23 AM
To: [log in to unmask]
Subject: [EM] Fw: "Embedded" passive and active devices for EPUG
This may give you a clue to truly "embedded" passive and active devices -
laminated inside the board. Numakura has his newsletter posted publicly on
a couple of web sites for PWB assembly. This is from last September.
Denny
----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 03/09/04 05:06 PM
-----
Dominique Numakura
Managing Director
DKN Research
62 Adams Street
Haverhill, Massachusetts 01830 U.S.A.
Telephone: 1-978-372-2345
Fax: 1-978-469-0188
EPTE Newsletter from Japan, September 28, 2003 (Electronic Packaging
Technologies)
Embedded Active Devices
There have been a lot of R&D works and considerations about EBD (Embedded
Passive Devices) Technology in the last several years. A lot of material
suppliers, PWB manufacturers, design houses and customers in the U.S. and
Asia have been involved for the big projects. They have been employing thick
film technologies, thin film technologies, etching technologies, plating
technologies, etc.
Also they have been proposing a lot of new unique materials.
Unfortunately, we have had very few volume applications currently.
There are many reasons, cost, investment, design, reliability, process
yield, patent issue, etc. We can not expect a quick take-off of the
technology for a while.
On the other hand, several major Japanese PWB manufacturers such as
Matsushita, DT Circuit Technology and Shinko Electric have been proposing
alternative EBD technologies, recently. The basic idea is to embed actual
chip components into the inner layers of the multi-layer boards. It can not
reduce the cost significantly, but it utilizes the space of the inner layers
more effectively. And it looks more practical, because it does not need very
unique materials or processes.
Another big advantage of the technology is the availability for the EAD
(Embedded Active Devices), actually bare chips. The manufacturers have been
showing actual examples. The strength of the companies is in the tight
relationship with the end customers.
They are working together for the actual projects to apply the new
technology. They will be the tough competitors for the orthodox EPD
technology manufacturers.
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