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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 10 Mar 2004 10:37:31 +0200 |
Content-Type: | text/plain |
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You have your answer. Reduce your co-plated organics and make sure that
you do not abrasively clean the copper before plating.
Brian
Jeff Brown wrote:
> Hi Aleks,
>
> Our brighteners are organic.
>
> Regards,
> Jeff
>
> -----Original Message-----
> From: Aleks Lozinsky [mailto:[log in to unmask]]
> Sent: Wednesday, 10 March 2004 12:07 PM
> To: TechNet E-Mail Forum.; Jeff Brown
> Subject: Re: [TN] Dewetting of silver plating
>
>
> Hi Jeff,
> Your "new" silver plating solution. Which type of brightener you using
> metallic or organic?
> Aleks Lozinsky
> Technic Canada
>
> ----- Original Message -----
> From: "Jeff Brown" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, March 09, 2004 7:32 PM
> Subject: [TN] Dewetting of silver plating
>
>
> Dear Soldering Gurus,
>
> I currently have a dewetting problem with silver electroplated parts and I
> was hoping that Technet would provide me with some suggestions.
>
> A brief history - Our silver plating solution has been changed as our old
> solution is no longer available. We are using water soluble 62/36/2Ag solder
> paste. Our soldering process works very well on old tarnished components
> from the previous plating solution, but demonstrates dewetting in components
> plated with the new solution. The rest of the process appears to be the
> same.
>
> Any hints on particulars to watch out for or test would be greatly
> appreciated.
>
> Regards and thanks,
> Jeff Brown
> The Australian National University
>
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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