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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 10 Mar 2004 08:52:10 +0100 |
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Wow Steeve
Can you send me a copy too?
Thanks a lot
Guenter
Mornin' Daan!
I'm sending you a paper called Solder Fatigue Reliability Issues in
Lead
Free BGA Packages given by Pedro Chalco of IBM. The paper was
presented
at the Pan Pacific Microelectronics Symposium sponsored by SMTA and
held
in Maui, on February 4-7, 2002.
There is reliability data from Lead Free BGA's being soldered with
SnPb
solder paste.
Best Regards,
-Steve Gregory-
> Hi Technet,
>
> I'm looking for a paper that was presented by Qualcomm at last year's
> IPC conference in Frankfurt. I heard it includes some good
information
> about the reliability of leadfree BGA's soldered with PbSn
> solderpaste. Is there anyone out there who's willing to provide me
> with a copy ?
>
> Daan Terstegge
> Thales Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net
>
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EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
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