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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 9 Mar 2004 06:32:13 -0600 |
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Steve,
I too have interst in reading the Lead Free BGA Packages given by
Pedro Chalco. Can you share with me.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, March 08, 2004 8:04 AM
To: [log in to unmask]
Subject: Re: [TN] Looking for a paper (IPC conference in Frankfurt)
Mornin' Daan!
I'm sending you a paper called Solder Fatigue Reliability Issues in Lead
Free BGA Packages given by Pedro Chalco of IBM. The paper was presented
at the Pan Pacific Microelectronics Symposium sponsored by SMTA and held
in Maui, on February 4-7, 2002.
There is reliability data from Lead Free BGA's being soldered with SnPb
solder paste.
Best Regards,
-Steve Gregory-
> Hi Technet,
>
> I'm looking for a paper that was presented by Qualcomm at last year's
> IPC conference in Frankfurt. I heard it includes some good information
> about the reliability of leadfree BGA's soldered with PbSn
> solderpaste. Is there anyone out there who's willing to provide me
> with a copy ?
>
> Daan Terstegge
> Thales Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net
>
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