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March 2004

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Fri, 19 Mar 2004 12:30:11 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Collins Graham <[log in to unmask]>
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Collins Graham <[log in to unmask]>
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Hi Doug!
Interesting assignment, much better than my current task.

1) I would say it should be both.  Obviously there are some
applications where folks are lucky to have pure SMT boards, but most
that I have crossed paths with are mixed technology.  While wave solder
should not have an influence on topside SMT parts, it would be somewhat
optimistic to leave it out.
2) tough question - adding more stuff makes it a better test, but then
makes it a more expensive test, more difficult to monitor.  Glued and
wave soldered parts?
3) I think a mainstream and a leading edge test would be more
appropriate, more design up front but would allow the user to select the
more appropriate vehicle.
4) well, think of what is associated with "the oldest profession"...

regards,

Graham Collins
Process Engineer,
Northrop Grumman Canada Corporation
Halifax
(902) 873-2000 ext 6215

>>> [log in to unmask] 03/19/04 12:17PM >>>
OK class, time for your next assignment.

Again, the topic is "qualifying" a manufacturing process, either in
house
or from a supplier.  Steve Gregory has been kind enough to post a
picture
for me

http://www.stevezeva.homestead.com and look for "IEC Coupon".

This is a coupon that has been proposed in the IEC specification that
Graham Naisbitt is working on.  There is some re-design efforts going
on
currently.  One such effort is to add through holes for a connector or
pin
field.  As you can see from the picture, the current board is purely
surface mount.

So, your assigment, in essay form, is to answer the following three
questions:

1.    As a process qualification vehicle, should the vehicle be pure
surface mount, or mixed technology (both SMT and PTH), and why?

2.    What would you add or subtract from the test board to make it
more
useful to you?

3.    Should there be two offerings of qualification vehicles,
"cutting
edge" vs. "mainstream"?  Cutting edge would incorporate fine pitch,
flip
chips, CSPs, etc., where the mainstream board would not.

4.    Extra Credit question:  What was the greatest thing "before"
sliced
bread?

Doug Pauls
Rockwell Collins

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