Hi Chris ,

I don't think it's only the flatness of the finish,
I think the rap against HASL on fine pitch devices
is the risk of solder bridging on the pads.

Andre Demers - C.I.D.
Summit Technologies Ottawa Inc.
329 March Road, Suite 203
Kanata, Ontario
Canada K2K 2E1
Phone  :(613) 599-3881
Fax      :(613) 599-7889
Pager   :(613) 368-0506
Email   :[log in to unmask]



-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: March 15, 2004 10:06 AM
To: [log in to unmask]
Subject: Re: [DC] Netlist?


Wuz wondering.... Why exactly is it that we abandon HASL for ni/au or
whatever on fine pitch designs? I know it's a finish flatness thing, but
can anybody 'splain it to me? Doesn't the solder paste process kind of
level the pads back out?

Funny what you think about when you can't sleep....
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