Hello Mike,
An underfill encapsulant will certainly help the improve the reliability
performance of a ceramic package assembled on an organic board, both for
survival of thermal cycle requirements and for mechanical stresses like
vibration and shock.
Process considerations are:
Dispensability
Underfill Flow rate
Cure time and temperature
Pot Life
Other pertinent considerations are:
Material properties:
Tg
CTE
Modulus
Reliability:
Tests
Conditions
Pass/Fail criteria
Zymet manufactures underfill encapsulants for a broad range of
applications. They can be contacted at [log in to unmask] or you can email me
directly
Regards,
Karl
Zymet
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