IPC BGA Update
Changes in IPC-7095 reflecting the Latest in BGA Implementation Strategy 
Tuesday, February 10, 2004
10:00 a.m. - 11:00 a.m. (CST)

Today's electronic equipment uses very complex parts which relate to board design and assembly issues.  Assembly is concerned about attaching all the leads to the mounting structure without bridging (shorts) or missing solder joints (opens).  Design is concerned with interconnecting all the leads and having sufficient room for routing conductors. Quality Control is concerned about the methods of inspection and process qualification.

This webcast addresses all the concerns that have been expressed by the industry and have been documented in the proposed revision A of IPC-7095. Originally released in August of 2000 many of the additions deal with the strategy for "Design and Assembly Process Implementation for BGAs". The webcast is a must for those contemplating using BGAs to those having to make the processes that produce high quality assemblies.

Participants will have a unique opportunity to obtain firsthand information on the updates now going through final ballot approval and comprehending the issues that affect BGA and FBGA assembly. The new sections deal with expanded information on Surface Finishes, X-ray inspection and the evaluation of voids in the solder ball or at the interface of the part or mounting surface.

If you're thinking: "Come-on, there's no way you can cover all the questions that an individual might have about BGA implementation in one hour!" You'd probably be right...with one exception: the update is being presented by Dieter Bergman, IPC Director of Technology Transfer.

This year Bergman will have been on the IPC staff for 30 years. He has been involved with the development of virtually every design standard, guideline or document developed by IPC. In the last two years he has worked with the dedicated BGA task group members under the Chairmanship of Ray Prasad to incorporate the latest thinking into the IPC-7095 on BGA technology. In January he met with members of the IPC-A-610 committee to make certain that the requirements of BGA implementation and those of the workmanship standard on Assembly evaluation and acceptance were in harmony. All of the new agreements will be explained in the webcast.

Topics covered in the presentation include: 

* Challenges for implementing BGA and Fine Pitch BGA technology
* Effect BGA and FBGA have on current technology
* New techniques for X-ray inspection
* Focus on critical repair, and reliability issues associated with BGAs
* Acceptance and how to determine the reliability of the assembly and attachment processes 
* How to determine when voids are detrimental to long term performance
* What issues can be handled under process control procedures 

For more information or to download the registration form, go to www.ipc.org or contact Alexandra Curtis at 847-790-5377.

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