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February 2004

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Feb 2004 10:27:53 +0200
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I agree that this sounds like a PCB fab problem. In my experience, it
could very well be due to the presence of a contaminant on the boards at
the moment the mask is applied. This could simply be that the boards
were nor sufficiently dry (yes, water can be a contaminant!).

I'm shocked at the idea of pumice or any other abrasive as a preparation
for solder mask. This is a ***sure*** way of destroying the
solderability. I've written at length on this subject in several books.
Abrasives and solderable surfaces are incompatible.

Brian

Suzanne Foulkes wrote:

> I know this was up for a discussion a few weeks ago. Can anyone tell me
> what the root cause was determined to be?
>
>  I am experiencing solder mask flaking on a group of boards manufactured
> by one certain supplier. It is a random occurrence for example 10 out of
> the 100 boards we had this occurr. Then a different board we ran 8 out
> of 40 were flaking same supplier as previous one.
>
> Supplier runs samples at his facility and he see's no flaking. We
> changed our solder temperature from 500 degrees to 450 degrees at the
> suppliers suggestion and flaking still occurs. He then states maybe were
> not using enough flux but review shows plenty of flux if anything maybe
> were using to much flux from the way the boards look coming out of the
> wave and washer.
>
> Thanks
> Sue Foulkes
> QA Manager
> AESCO Mfg.
>
>
>
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