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February 2004

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- Bogert <[log in to unmask]>
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Date:
Mon, 9 Feb 2004 18:30:57 -0500
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February 9, 2004

I previously sent e-mail regarding soldering problem an OEM was having soldering to gold plated brass standoff terminals.  The problem was traced to "black nickel" due to poor plating process that deposited the nickel flash (improper control of phosphorus content).  To solve the problem, the OEM switched to a copper flash over the brass.  The copper flash produced good solder joint when soldered to 18 gage nickel plated wire.

Question I have is there any difference in joint reliability using copper flash versus nickel flash over gold-plated brass terminals?  Also what is recommended min and max value for phosphorus when nickel flash 
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