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February 2004

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Feb 2004 11:29:58 -0500
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text/plain (95 lines)
Understood & thanks.

Rich Kraszewski 
Advanced Manufacturing Engineer - KEDS
Phone:  260.925.8919
 
 
 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Somtawin
Pornpottanamas
Sent: Thursday, February 05, 2004 8:07 PM
To: [log in to unmask]
Subject: Re: [TN] Goldresidues in non-plated holes


As I know ENIG in plated through hole come from electroless copper
plating. In Electroless copper process it has one step that we call
activator normally will contain Palladium. Sometime after electroless it
still remain some palladium in hole. So when they come through ENIG , as
you know  this process also used palladium before plated Nickel. What
happen is everywhere that has palladium nickel will plated and then
Gold.




Somtawin Pornpottanamas
Material Engineer
Kimball Electronics (Thailand)
Tel. 038-401566  ext. 211
Fax. 038-495029

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of d. terstegge
Sent: Thursday, February 05, 2004 10:13 PM
To: [log in to unmask]
Subject: [TN] Goldresidues in non-plated holes

Hi Technet,

I looked at an ENIG board today and noticed it had some gold-residues in
the nonplated holes. I always thought that a non-plated hole should not
have any plating at all, but seeing this condition for the second time
(the first time was on a board from another manufacturer and another
designer) I almost begin to think this is a normal condition. What do
you think, is this normal, is it acceptable (I don't think so), any idea
what causes it ? For those who like to see a photograph of this, see:
http://www.smtinfo.net/forum/index.php?showtopic=40

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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