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February 2004

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Subject:
From:
Douglas Corbett <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Feb 2004 09:00:05 -0600
Content-Type:
text/plain
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text/plain (140 lines)
Ezequiel,

I have seen very good success with that rework method.
If they do it right, you will not be able to tell the difference. If the
masking doesn't hold, you might get some wisps of solder on the contact
pads, but the integrity of the gold will remain.
Save yourself and the board house some grief. Accept the reworked boards.

DOug

On Thu, 5 Feb 2004 08:36:00 +0200, Reuven ROKAH <[log in to unmask]>
wrote:

>You should take care to the cleanliness of the PCBs after the process.
>If the PCBs have plugging via holes, active residues can be left there and
>it almost impossible to remove them.
>Also solder balls from the HASL process can be created in via holes.
>
>The good things are that the PCBs have new finish (solderability) and 100%
>thermal stress.
>
>
>Best  Regards
>
>ROKAH
>
>
>
>                      Eddie Rocha
>                      <[log in to unmask]         To:      [log in to unmask]
>                      om>                      cc:
>                      Sent by: TechNet         Subject: Re: [TN] Rework
Gold Finish
>                      <[log in to unmask]
>                      >
>
>
>                      04/02/2004 19:48
>                      Please respond
>                      to EddieR
>
>
>
>
>
>If the amount of gold is less than ~20 uin, then rework might be an
>option. Too much gold will result in embrittlement issues with your
>solder joints.
>
>On 4 Feb 2004 at 8:47, Ezequiel Cruz wrote:
>
>Can anyone help with the following:
>
>My board house built my boards with a gold finish.
>The finish should have been selective gold as we have some
>contact areas on
>the pwb.
>
>I have insisted on a re-build which is currently being done. However,
>because of our all ready late schedule, the board house has offered
>to re-
>work the gold finish boards for us. The method explained to me was
>mask the
>selective gold areas and flux clean the remaining board while
>dipping in
>molten solder.
>
>Does anyone have any experience with re-working this way. Our
>biggest
>concern is from a re-liability standpoint. Obviously this board will go
>through additional thermal cycling not necessarily part of a standard
>build. What effect, if any, will this have on the board itself.
>Remember
>that our stuffing house will place this board through additional
>thermal
>cycling.
>
>Any help is greatly appreciated.
>
>Ezequiel Cruz
>
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>-----------------------------------------------------
>-- Thanks,
>Eddie Rocha
>(408) 978-8992 x 282
>
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