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Subject:	PCB Thermal Capabilities
From:	"Dore, Moss (GE Energy, consultant)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 27 Feb 2004 19:34:51 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (23 lines)

Hi all

I am looking for information and specifications on the time that a PCB (FR4, Tg 130 - 140degC)  can withstand REWORK temperatures.

I amn't overlooking all other rework considerations such as component capability, solder, flux etc as well as PCB specific issues such as CTE, Thermal Shock, Thermal Mass, Solder Mask.

I am just trying to reference an IPC or MIL STD specification that tells me FR4 will withstand Xsecs above Tg temp and Xsecs above solder liquidus.


All assistance appreciated
Best Rgds
Moss

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