Bill,

How many components are you soldering on each board.  If it is only a
couple, I would agree with Steve Gregory that a Zephyrtronics system is
a good alternative process to the Airvac.  If you have a board full of
connectors we might have a system that could help you out.

We ran .188" boards here for a customer and were getting good hole fill.
 I have talked to them since and they have been using the system
successfully on boards up to .250".  This machine runs a slow process
with lots of preheat so its not really suitable for high volume but does
a good job on thick boards.  If you would like more information please
give me a call.

Steve Pence
Unit Design, Inc.
714-672-9944

Mengers, William D. wrote:

>Hi everyone,
>
>I am a Manufacturing Engineering in an area that builds test equipment for
>airborne radar systems.  For the past several months Design Engineering has
>been giving us a variety of "thick" boards to which to solder thru hole
>components.  The boards range in thickness up to .250".  We have been
>substituting press-in sockets where possible, but they are not always
>available in the sizes we need.  So far, in the most difficult situations, I
>have been using an Airvac solder volcano.  This works fairly well, but can't
>be used in all situations, and doesn't always result in flow thru to the
>other side.
>
>Is there any other system that would be more appropriate for thick boards
>where flow thru is a problem?  We are working to            J-Std-001B Class
>3.  We are ready to go back to the designers (and have gone back to them),
>but I would like to find out if there are other possibilities first.
>
>Thanks for any help you can give,
>
>Bill Mengers
>Mfg. Engineer
>Northrop Grumman Corp.
>Baltimore
>
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