Water sol products are used routinely in manufacturing many types of
leadless area array devices. In assembly access can be an issue for any
process involving aqueous or semi aqueous (as for no cleans) processes
as Ryan describes.
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ryan Grant
Sent: Tuesday, February 24, 2004 10:26 PM
To: [log in to unmask]
Subject: Re: [TN] BGA and Water solube paste
Hi Yannick,
Water soluble paste and the alloy mixture of the paste and/or BGA have
nothing to do with each other. Water soluble is talking about the flux
vehicle of the solder pastes (the non-metal stuff in the solder paste).
2% silver alloy solder paste is absolutely compatible with BGA.
Water soluble flux is compatible with BGA, but your cleaning equipment
may not be compatible with BGA. Water soluble flux residue must be
cleaned off the PCB very well or you are very likely to have
electromigration failures after some time in the field. If the BGA ball
diameter is 0.030" or larger, most modern in-line aqueous cleaners do a
fine job. When you get to 0.013" diameter BGA balls, cleaning life
becomes difficult, (but not impossible). Anything in-between and clean
ability just depends.
Ryan Grant
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Yannick Brisson
Sent: Tuesday, February 24, 2004 2:47 PM
To: [log in to unmask]
Subject: [TN] BGA and Water solube paste
Hi,
Somebody here just ask me something about BGA and water soluble
paste. He wants to know if water soluble and BGA could work together.
Most of the BGA avec a ball of 63/37 and water soluble can have the same
composition too but some have 2 Ag in it. Can it be compatible? What
about the flux?
Thank you
Yannick
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