Hi everyone,

I am a Manufacturing Engineering in an area that builds test equipment for
airborne radar systems.  For the past several months Design Engineering has
been giving us a variety of "thick" boards to which to solder thru hole
components.  The boards range in thickness up to .250".  We have been
substituting press-in sockets where possible, but they are not always
available in the sizes we need.  So far, in the most difficult situations, I
have been using an Airvac solder volcano.  This works fairly well, but can't
be used in all situations, and doesn't always result in flow thru to the
other side.

Is there any other system that would be more appropriate for thick boards
where flow thru is a problem?  We are working to            J-Std-001B Class
3.  We are ready to go back to the designers (and have gone back to them),
but I would like to find out if there are other possibilities first.

Thanks for any help you can give,

Bill Mengers
Mfg. Engineer
Northrop Grumman Corp.
Baltimore

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