Dear technetters

We are doing solder mask on key pad pcbs after gold plating. In this process,gold plating thickness is reduced during mechanical scrubbing operation which is done just before solder mask flooding. Is there any solution to avoid reduction of gold plating thickness? 

Also let us know, whether gold plating can be done after the solder masking process? If so briefly explain the process.

Regards,

Mr.Murulidhara S.
Deputy Chief Engineer ,
PCB and Chemical Lab - R&D,
ITI Ltd. ,
Dooravani Nagar , 
Bangalore
INDIA
PIN-560 016

Ph : 91-080-8503959
Fax : 91-080-5650971



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