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February 2004

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Subject:
Surprising Reliability question
From:
Yuan Li <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Feb 2004 16:25:30 -0800
Content-Type:
text/plain
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text/plain (20 lines) 
One of my colleagues stated that some failure mode like flip chip
bump/UBM crack occurred only at TCK but not at TCB thermal cycling test.
I was very surprised. TCB is -55 - 125 while TCK is 0 -125 degree C,
both air to air thermal cycling. It just does make sense to me.
Is it possible?

Thanks,

Yuan

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