Hi guys! Well, here is more information to add to the confusion; The Metal
Finish Suppliers Association Electroless Nickel Plating Guide (volume 1,
no. 5) lists specifically a boron range of 0.1%-0.3% for soldering
applications and describes in general of keeping the boron less than 1% for
solderability.
Dave Hillman
Rockwell Collins
[log in to unmask]
Vladimir Igoshev
<[log in to unmask] To: [log in to unmask]
> cc:
Sent by: TechNet Subject: Re: [TN] Electroless Ni-B
<[log in to unmask]>
02/18/2004 11:29
AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
Vladimir Igoshev
Steven,
Thanks a lot. I haven't been very successful in my search. So far I found
very contradictory data, saying that for a solderable surface it should be
between 0.1% and 10% of B, or up to 3-5% (from another source). I've also
posted the question on the www.finishing.com website and hope it'll help.
You can keep an eye on it from here.
http://www.finishing.com/274/65.html
I want to know what the difference is at the solder/plating interface
between two types of EN. May I ask what is your concern?
Regards,
Vladimir
Vladimir Igoshev,
Research in Motion
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: Creswick, Steven [mailto:[log in to unmask]]
Sent: Wednesday, February 18, 2004 12:10 PM
To: TechNet E-Mail Forum.; Vladimir Igoshev
Subject: RE: [TN] Electroless Ni-B
Vladimir,
Since no real "plating person" has yet replied, I will toss out what meager
info I have.
My notes were that <1% B yielded readily solderable and wedge bondable
surfaces where as baths of 2-3% B were noticeably hard (but no notation on
wirebondability or solderability). Some baths can be 5-6% B, but have no
specific comments of them either.
Should you get any further comments, I am very interested in them as well.
Sorry, but I can not define what 'normal' is. Presume it is specific to
the plating house and what they are currently running.
Steven Creswick - Gentex Corporation
-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Tuesday, February 17, 2004 1:32 PM
To: [log in to unmask]
Subject: [TN] Electroless Ni-B
Techneters,
Does anybody know what a "normal" content of boron should be in an
electroless Ni-B plating?
Thanks a lot in advance.
Vladimir Igoshev,
Research in Motion
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