Steven,
Thanks a lot. I haven't been very successful in my search. So far I found very contradictory data, saying that for a solderable surface it should be between 0.1% and 10% of B, or up to 3-5% (from another source). I've also posted the question on the www.finishing.com website and hope it'll help. You can keep an eye on it from here.
http://www.finishing.com/274/65.html
I want to know what the difference is at the solder/plating interface between two types of EN. May I ask what is your concern?
Regards,
Vladimir
Vladimir Igoshev,
Research in Motion
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
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-----Original Message-----
From: Creswick, Steven [mailto:[log in to unmask]]
Sent: Wednesday, February 18, 2004 12:10 PM
To: TechNet E-Mail Forum.; Vladimir Igoshev
Subject: RE: [TN] Electroless Ni-B
Vladimir,
Since no real "plating person" has yet replied, I will toss out what meager info I have.
My notes were that <1% B yielded readily solderable and wedge bondable surfaces where as baths of 2-3% B were noticeably hard (but no notation on wirebondability or solderability). Some baths can be 5-6% B, but have no specific comments of them either.
Should you get any further comments, I am very interested in them as well.
Sorry, but I can not define what 'normal' is. Presume it is specific to the plating house and what they are currently running.
Steven Creswick - Gentex Corporation
-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Tuesday, February 17, 2004 1:32 PM
To: [log in to unmask]
Subject: [TN] Electroless Ni-B
Techneters,
Does anybody know what a "normal" content of boron should be in an electroless Ni-B plating?
Thanks a lot in advance.
Vladimir Igoshev,
Research in Motion
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