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February 2004

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Feb 2004 09:22:12 EST
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text/plain
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text/plain (19 lines)
Hi Ramon,
You are too optimistic--"Not to mention the extra stress that is going to be 
placed on the components as the reflow profiles have to be 20 degrees higher 
than they are

now"--try mmore like 30 to 35°C.

Werner Engelmaier

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