TECHNET Archives

February 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Somtawin Pornpottanamas <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Feb 2004 03:08:57 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (55 lines)
Baking will make the laminate to get more cure. If laminate cure not
enough, after drilling you will found rough hole wall. And when it
passed plated through process, rough area will etched more by
permanganate. That mean you will get the rough hole wall and sometime
can cause short at the interconnection area (multilayer). Sometime it
also can cause 
the problem shrink and extend boards.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Parial Swati
Sent: Wednesday, February 18, 2004 2:26 PM
To: [log in to unmask]
Subject: [TN] Baking of Laminates before processing

Dear Technetters,

We have the procedure of Baking FR4 laminates used for making Double
side
boards before Drilling them.
Can any one advise as to why is this baking process needed ?
What are the implications of processing without baking ?

Warm regards,
Swati...
Scan by AT&S virus protection

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2