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February 2004

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Subject:
From:
karpinski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Feb 2004 22:38:09 +0100
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Hi Vladimir,

As I know it is Pd.
regards

Vladimir Igoshev schrieb:

>Hi Waclaw,
>
>Do you know what material (Pd or Ru) your board supplier uses to deposit electroless Ni?
>
>Vladimir Igoshev,
>Research in Motion
>
>Voice: (+1) 519-888-7465, ext. 5283
>Fax: (+1) 519-886-0863
>E-mail: [log in to unmask] <mailto:[log in to unmask]>
>
>
>-----Original Message-----
>From: karpinski [mailto:[log in to unmask]]
>Sent: Wednesday, February 18, 2004 4:15 PM
>To: [log in to unmask]
>Subject: [TN] Ni/Au solderability on kapton
>
>
>Recently we have solderability problems with Ni/Au kapton flex boards
>(0,1 µm Au, 3 µm Ni, 35m Cu).
>We have produced and assembled large number of boards.
>On 10 % of the boards we observe interconnection failures after final
>assembly of the pcbs. If  the suspected solder joints are lightly
>stressed , the connections are easily broken, leaving an open circuits.
> It is  easy to peel  these parts with solder material  from the boards.
>The pads below the removed parts are discolored dark gray and are sleek .
>Some times the handsoldering of the broken joins was successful but
>after small strain the joints  broke again.
>Additional vapor phase soldering  did not improved the the strength of
>the joints.
>This is new problem for us. Does anyone have any experience with this?
>How to rework the boards? How to determine when a board should be
>reworked or
>scrapped? What about reliability issues? Latent failures?
>I would appreciate your help very much
>  regards
>
>--
>Waclaw Karpinski
>I. Physikalisches Institut
>RWTH Aachen
>D - 52074  Aachen
>
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>

--
Waclaw Karpinski
I. Physikalisches Institut
RWTH Aachen
D - 52074  Aachen
Sommerfeldstr 14, Turm 28
Tel.: +241 802 7181
Fax.: +241 802 2623
Mobil: 0049 173 70 22 548

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