Looking for feedback on what pad geometries are being used these days
for standard 0805 chips. We are primarily a high-rel, low volume high
temp alloy shop, but have recently pulled in a standard Sn63 board in
volume that the customer is looking for a little layout assistance on.
Pad dimensions are way too large and pad-to-pad spacing too tight,
contributing to big fillets and squeeze balls at the component edges. It
could be worked through aperture changes in the stencil, but the fab is
being spun for another reason anyway so now's a good time to fix 'em up.
Seems that almost every component manufacturer is calling out there own
pad preferences, many of which are contradictory to IPC design
guidelines. Also, any new comments on the pros and cons of using pads
that are slimmer than the termination width of the component? TIA for
the insights....

Mike

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