Good information at this site, but it seems like the
link to:
-GEIA G-12 Committee, "GEB-0002: Reducing the Risk of Tin
Whisker-Induced Failures in Electronic Systems", December 2003
Seems to be broken. Anyone have a copy of this report or
know where to get one?
-Joe
-----Original Message-----
From: David Douthit [mailto:[log in to unmask]]
Sent: Friday, February 13, 2004 12:09 PM
To: [log in to unmask]
Subject: Re: [TN] Pure Tin Component Finish
Scott,
Go to: http://www.nepp.nasa.gov/whisker/index.html
For the latest and greatest on tin whiskers.
David A. Douthit
Manager
LoCan LLC
Newland, Scott wrote:
>During our resent lead free evaluation it was discovered that several of
our
>component vendors are changing their finishes from tin- lead to pure tin.
Quite
>often this change is being made with no part number change, so these part
are
>getting to our manufacturing floor without anyone knowing they have a
different
>finish. This has lots of people's attention due to the Hi Rel nature of
most of
>our products. We have narrowed our concerns to two: tin whiskers and
solder
>joint reliability. There is a lot of work being performed on tin whiskers.
Do
>you see the pure tin component finish impacting the tin- lead solder joint
>metallurgy to the point of impacting high or low cycle fatigue?? Typical I
>would think the component finish would be a small percentage of the total
volume
>of the solder joint, resulting in minimal impact. But I'm afraid the
>inter-metallic layers maybe impacted, resulting in changed reliability.
>
>The opinions of this group would be valued.
>
>
>Scott Newland
>Harris GSCD
>321 727 6472
>Pager 321 690 4131
>E-Mail <mailto:[log in to unmask]> [log in to unmask]
>For a brain teaser try:
> <http://pao.gsfc.nasa.gov/science.html>
http://pao.gsfc.nasa.gov/science.html
>
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