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February 2004

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Feb 2004 10:08:49 -0700
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Scott,

Go to: http://www.nepp.nasa.gov/whisker/index.html
For the latest and greatest on tin whiskers.

David A. Douthit
Manager
LoCan LLC

Newland, Scott wrote:

>During our resent lead free evaluation it was discovered that several of our
>component vendors are changing their finishes from tin- lead to pure tin.  Quite
>often this change is being made with no part number change, so these part are
>getting to our manufacturing floor without anyone knowing they have a different
>finish.  This has lots of people's attention due to the Hi Rel nature of most of
>our products.  We have narrowed our concerns to two:  tin whiskers and solder
>joint reliability.  There is a lot of work being performed on tin whiskers.  Do
>you see the pure tin component finish impacting the tin- lead solder joint
>metallurgy to the point of impacting high or low cycle fatigue??  Typical I
>would think the component finish would be a small percentage of the total volume
>of the solder joint, resulting in minimal impact.  But I'm afraid the
>inter-metallic layers maybe impacted, resulting in changed reliability.
>
>The opinions of this group would be valued.
>
>
>Scott Newland
>Harris GSCD
>321 727 6472
>Pager  321 690 4131
>E-Mail  <mailto:[log in to unmask]> [log in to unmask]
>For a brain teaser try:
> <http://pao.gsfc.nasa.gov/science.html> http://pao.gsfc.nasa.gov/science.html
>
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