TECHNET Archives

February 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Newland, Scott" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Feb 2004 08:04:40 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines)
During our resent lead free evaluation it was discovered that several of our
component vendors are changing their finishes from tin- lead to pure tin.  Quite
often this change is being made with no part number change, so these part are
getting to our manufacturing floor without anyone knowing they have a different
finish.  This has lots of people's attention due to the Hi Rel nature of most of
our products.  We have narrowed our concerns to two:  tin whiskers and solder
joint reliability.  There is a lot of work being performed on tin whiskers.  Do
you see the pure tin component finish impacting the tin- lead solder joint
metallurgy to the point of impacting high or low cycle fatigue??  Typical I
would think the component finish would be a small percentage of the total volume
of the solder joint, resulting in minimal impact.  But I'm afraid the
inter-metallic layers maybe impacted, resulting in changed reliability.

The opinions of this group would be valued.


Scott Newland
Harris GSCD
321 727 6472
Pager  321 690 4131
E-Mail  <mailto:[log in to unmask]> [log in to unmask]
For a brain teaser try:
 <http://pao.gsfc.nasa.gov/science.html> http://pao.gsfc.nasa.gov/science.html

This information is only intended for the use of the individual or entity named
in this email.  If you are not the intended recipient, you are hereby notified
that any disclosure, copying, distribution, or use of the contents of this
information is strictly prohibited.  If you have received this email in error,
please notify me and delete it immediately.


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2