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| Reply To: | TechNet E-Mail Forum. |
| Date: | Thu, 12 Feb 2004 09:48:00 +0800 |
| Content-Type: | text/plain |
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But temperature cycling may arouse other failure mechanism. Although
temperature range and ramp rate can be controled, it may not totally avoid
from the thermal failure. I had used X ray and scanning acoustic
microscopy to inspect the micro crack, but it can only show out a black
shallow.
Regards,
Ernie
"Misner, Bruce" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/11/2004 ¤U¤È 11:49
Please respond to
"TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
"Misner, Bruce" <[log in to unmask]>
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Subject
Re: [TN] Crack Inspection in component
Yes, temperature cycling prior to Final Test.
Regards,
Bruce Misner
-----Original Message-----
From: Ernie Fung [mailto:[log in to unmask]]
Sent: Tuesday, February 10, 2004 10:47 PM
To: [log in to unmask]
Subject: [TN] Crack Inspection in component
After the PCB assembly, fine and random crack may appear inside the
ceramic
capacitor. However, ICT may not identify this failure and it influences
the
reliability. Is there any method to inspect the fine random crack before
sending out to the customer?
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