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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 11 Feb 2004 13:23:14 -0600 |
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Register TODAY for the Lead Free Series!
March 8, 2004 ? Holiday Inn Select Stamford? Stamford, CT
March 10, 2004 ? Courtyard by Marriott ? Columbus, OH
Lead Free System-Part I: Lead Free Interconnections--Technology and Manufacturing
Course instructor: Dr. Jennie Hwang
Time: 8:30 am - 11:30 am
The purpose of the course is to provide broad-based information, as well as specific critical factors to facilitate the implementation of lead-free manufacturing. Environment-friendly manufacturing and designing products that are ultimately safer at the end of life cycle are essential to technology-business competitiveness. This workshop will cover global legislative status, technological base, product assessment and manufacturing considerations.
Price: $395 IPC Members $595 Non-members
To download the registration form and more information go to http://www.ipc.org/calendar/leadfree1_030804/lf1_0308.htm or contact Alexandra Curtis at [log in to unmask] or via phone at 847-790-5377.
Lead Free System-Part II: Lead Free Components & PCB Surface Finish
Course instructor: Dr. Jennie Hwang
Time: 1:00 pm - 4:00 pm
This course will provide a proper level of understanding of the important factors that determine the solderability and performance of surface finishes and component coatings under SMT manufacturing. The viable material and process options of PCB surface finish and component lead-coating will be separately reviewed. The instructor will discuss the role of intermetallics and gold, tin whisker, black pad issue and Bi effects.
Price: $395 IPC Members $595 Non-members
To download the registration form and more information go to http://www.ipc.org/calendar/leadfree2_030804/lf2_0308.htm or contact Alexandra Curtis at [log in to unmask] or via phone at 847-790-5377.
March 11, 2004 ? Courtyard by Marriott ? Columbus, OH
Lead Free Systems-Part III: Implementation & Production
Course instructor: Jennie Hwang
Time: 8:30 am - 11:30 am
This course focuses on the SMT manufacturing know-how necessary to achieve the yield, quality and reliability during lead free implementation. The course covers the key process modules including solder paste printing and reflow, and discusses the system compatibility between the BGA/CSP solder sphere, assembly solder paste, component coating and PCB substrate surface finish.
Price: $395 IPC Members $595 Non-members
To download the registration form and more information go to http://www.ipc.org/calendar/LeadFree3_031104/lf3_031104.htm or contact Alexandra Curtis at [log in to unmask] or via phone at 847-790-5377.
Register 3 people from your company and receive the 4th registration FREE!
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