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February 2004

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Subject:
From:
Russell Burdick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Feb 2004 07:21:51 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (122 lines)
I've seen this defect remove the hair of a good process engineer at a
previous employer. Ground plane copper with any residual moisture then add
LPI and the result is peeling/flaking soldermask.

We did not have an option for pumice, but the alternative oxide processes
created a great surface prep prior to LPI mask. Not to mention the chemistry
is stable and dirt cheap. In my old days I remember people describing pumice
scrubbers as capable of 'eating themselves slowly', I'm unsure of costs
related to keeping one satisfied to chewing on the panels instead.


>From: Franklin D Asbell <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>,              Franklin
>D Asbell <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Solder Mask Flaking
>Date: Wed, 11 Feb 2004 07:33:53 -0600
>
>Totally agree...
>
>
>----- Original Message -----
>From: "Brian Ellis" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Wednesday, February 11, 2004 2:16 AM
>Subject: Re: [TN] Solder Mask Flaking
>
>
> > The key is post pumice rinse/clean/dry...the boards need to exit the
> > machine spotless... and poorly solderable!
> >
> > Brian
> >
> > Franklin D Asbell wrote:
> >
> > > Tony,
> > >
> > > Do you have a pumice scrubber? We use an Hyoki aluminum oxide pumice
> > > scrubber prior to solder mask. Since buying this machine our problems
>with
> > > solder mask have dropped off to near nothing.
> > >
> > > We did tests some time back when we were evaluating different masks,
>we
> > > coated an 18X24 panel after pumice scrub...it came out nice and flat,
> > > smooth, even, etc etc etc...we could not have achieved those results
>without
> > > it I'm sure...
> > >
> > > The key is post pumice rinse/clean/dry...the boards need to exit the
>machine
> > > spotless...
> > >
> > > Franklin
> > >
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