Try the IPC-7095 Design and Assembly Process Implementation for BGAs. You
can find it on the IPC web site. This document delivers useful and practical
information to anyone who is currently using BGAs. In addition to providing
guidelines for BGA inspection and repair, IPC-7095 also addresses
reliability issues associated with BGAs. 77 pages. Released August 2000.

My CM uses this document when voiding in solder balls is judged detrimental
to assembly process. FYI, this standard is more tough to meet than the
IPC-A-610c on voiding.

Eric

-----Original Message-----
From: Antonio c T Souza [mailto:[log in to unmask]]
Sent: Wednesday, February 11, 2004 8:38 AM
To: [log in to unmask]
Subject: [TN] BGA Solder bumps deformation


Please

Could someone inform where can I find data about BGA solder bumps
deformation acceptance criteria?

Thanks

Antonio
Brasil

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