Hi,

What are the main temperature considerations when your placing shielding over BGA's, 0402 and 0201 chipcomponents.
On this particular board there are 5 BGA's 3 of them will be underneath a shield and we would like to place them all in one run.
We do have a forced convection in our reflow oven

I would like to know the pros and cons before we are going to start profiling.

All suggestions are welcome.

Hilbrand

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