We are in the middle of a big discussion regarding pretinning gold plated
component leads. J-STD-001 says that anything over .0984 mil has to be
removed by tinning, implying anything under does not. Our terminal
manufacturer and the mil spec MIL-G-45204C, now defunked, says that they
have a minimum thickness of 0.00005 inch and a maximum thickness of 0.00010
inch. Granted you don't know the actual thickness of the plating because it
can be anything up to 0.00010 mil.

Since you are never sure what the thickness will be how do you determine
whether to tin or not? The difference between the J-STD and the top plating
spec isn't much. I would assume that the pin manufacturer is going to put on
the minimum amount of gold due to costs.

It is very time consuming to tin the number of gold component leads we have
and would like to know you opinions. To clean or not to clean that is the
question?

Thanks,

KennyB

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