Suzanne,
I am commenting from a board fabricators experience
and after reviewing the pictures on Steve's website
I would have to say that again it is poor surface preparation prior to the
soldermask application,
which appears to be LPI mask on you board versus
DFSM on Steve's snake board. One thing I would like to point out in both
cases it is solid copper areas which are peeling-one way you can help on
your end is make those areas "cross hatched" instead of solid copper, that
way you are not bonding to such a large copper area and you are also bonding
to the FR4 substrate.
It is somewhat difficult to get the right surface topography when bonding to
large copper areas.

Tony Steinke
AIT-Atlanta Inc.

----- Original Message -----
From: "Steve Gregory" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, February 10, 2004 8:50 AM
Subject: Re: [TN] Solder Mask Flaking


> Mornin' Sue!
>
> Your pictures are up! Go to: http://www.stevezeva.homestead.com and look
at
> "Mask Flake" , and "Mask Flake 2".
>
> The copper looks oxidized, so I don't know what to think, except that
there
> was something on the fab that prevented the mask from adhering.
>
> -Steve Gregory-
>
>
> > Yes Please do Steve. The supplier I'm dealing with is customer mandated
> > and I have contacted our customer telling him the problems I am
> > experiencing and he has admitted to me if he audits him he would
> > probably fail but he supports us in any way he can. I say audit him and
> > look for another Supplier.
> > As far as the copper not having the same shine I thought maybe it had
> > contaminants from the plating process and therefore the masking wasn't
> > adhering. What do you think on this?
> > Thanks so much
> > Sue
> >
>
>
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